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and SEMI C8
Only requirements for some attributes are specified in Tables 1 and 2
3 This Specification defines basic metrics for:
NOTICE: This Document was balloted and approved for withdrawal in 2008
本スタンダードは，global Compound Semiconductor Committeeで技術的に承認されている。現版は2010年12月21日，global Audits and Reviews Subcommitteeにて発行が承認された。2011年2月にwww
G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages StdTpc-Equipment Models and SEMI C8The purpose of this test is to determine the thermal resistance of molded plastic packages using thermal test chips. This Test Method deals only with junction to case measurements of thermal resistance and limits itself to fluid bath testing environments. For this test, conduction through the leads is minimized, thus providing information on the ability of the plastic package material to dissipate heat. This Test Method should only be used for
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